AMD partners with MediaTek to develop Wi-Fi 6E

AMD and MediaTek have announced a new collaboration to develop the AMD RZ600 Series Wi-Fi 6E modules using the Figic 330P chipset and engineering-leading Wi-Fi solutions.

The Figic 330P chipset will power the next generation of AMD Ryzen series laptops and desktops in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference than other signals.

AMD and MediaTek are developing PCIe and USB interfaces for power management by optimizing the AMD RZ600 Series Wi-Fi 6E modules, with a focus on delivering seamless connectivity experiences for users. Additionally, the optimization process includes stress testing and ensuring compliance standards for OEM customers, reducing development time.

The Filogic 330P supports the latest 2 x 2 Wi-Fi 6 (2.4/5 GHz) and 6E (6 GHz band up to 7.125 GHz) connectivity standards along with Bluetooth® 5.2 (BT / BLE). The highly efficient chipset features ultra-fast performance with support for up to 2.4Gbps connectivity, including support for the new 6GHz spectrum and 160MHz channel bandwidth. The chipset also integrates MediaTek’s Power Amplifier (PA) and Low Noise Amplifier (LNA) technology, resulting in improved power consumption, allowing the Figic 330P chips to be placed in laptops of all sizes.

Seamless connection, long battery performance

“Having a fast and reliable wireless connection has become critical due to consumer demands for speed, bandwidth, and increased performance, particularly due to the increase in video calling, streaming, and gaming,” said Saeed Michalani, Senior Vice President and General Manager, Customer Business Unit, AMD. The combination of powerful AMD Ryzen processors and leading advanced connectivity technologies from MediaTek will deliver an incredible comprehensive computing experience.”